STRIKE ANYWHERE Quit talking yourself out of that risky open-face shot and strike it anywhere with new CBX Full-Face 2 Wedges. Their full-face grooves are designed to help silence your inner naysayer and unleash your inner shotmaker. With the largest striking area ever on a CBX Wedge, plus the dynamic HydraZip face—designed to boost spin from any condition—these Wedges aren’t just forgiving, they’re darn fun to play.
TECHNOLOGY
HYDRAZIP – New HydraZip technology features dynamic face blasts formulated to create mighty surface textures that maximize friction for improved spin consistency in wet or dry conditions.
In the CBX Full-Face 2 lineup, loft groupings 50°–52° and 54°–60° receive different blast media and laser patterns. Lower lofts receive a less rough blast, while higher lofts receive a rougher blast and more laser lines for more consistent dry and wet spin performance across the course.
ZIPCORE – Set in the heart of the Wedge, ZipCore is a new addition for CBX Full-Face 2. Our proprietary, lightweight and low-density core technology, ZipCore reduces vibrations while also perfecting the Center of Gravity and boosting MOI for increased feel, control, consistency and forgiveness.
ULTIZIP – UltiZip’s network of sharp, deep, and tightly spaced grooves enhances spin characteristics for purer performance on every strike. This series is equipped with the sharpest groove radii ever in a CBX Wedge, imparting more spin and more control into all your shots.
LARGER FULL-FACE PROFILE – Hit more extreme, open-face shots with a larger face size—the largest contact area ever on a CBX Wedge. Plus, with 13% more contact area than our RTX Full-Face, that means more grooves from hosel to toe for more forgiveness, no matter where you strike it.
FORGIVING SOLE GRINDS – A new full-sole design with a higher bounce on 50° and 52° lofts provides optimal forgiveness on full swing shots. The C-Shaped sole, featured on 54°–60° lofts, has added bounce in the center and less in the heel for forgiveness and greenside versatility.
All sole grinds also feature a new leading-edge bounce chamfer that helps reduce chunking on challenging chips.
